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Sputtering
Deposition of Tantalum Nitride, Titanium and Palladium with nanometric accuracy for high-frequency applications.
TantalumTitaniumPalladium
✦ ISO Certified
Clean Room Facilities
Rigorous control environments for high-frequency Thin Film processes with nanometric accuracy
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UV Photolithography
High-yield pattern transfer with resolution down to a few microns, from mask design to finished component.
UV LithographyMask DesignEtching
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Chip & Wire
Fully automated process with micrometric accuracy for applications up to W-band and beyond 100 GHz.
Gold WireVideo Control
Production Process
Module assembly yield critically depends on component cleanliness. For this reason, the first stage of the production process involves plasma cleaning of the printed substrate on which the devices are mounted. Fixation is achieved through high-precision selective dispensing of electrically and thermally conductive adhesive, followed by a pick-and-place step with video control. The positioning accuracy achieved is suitable for frequencies up to and beyond 100 GHz.
After the fixation phase, all modules undergo a second plasma cleaning to improve yield in the subsequent wire bonding stage. Only gold wires or ribbons are used, with ribbon edge bonding processes; bond placement is controlled via video recognition. To ensure bonding effectiveness, a pull test is performed inline on a daily basis.
The production process is completed with the placement and sealing of the module lid. On request, assembled modules can be 100% electrically tested and packaged in tape and reel for automated installation in the final apparatus.
Clean Room Processes
All processes take place in rigorous control environments (class 10,000 clean room and class 100 laminar flow benches)
Nanometric accuracy for thin layers
From mask design to finished component
High-quality metallisation
Selective material removal
Precision substrate separation
Automated dispensing, pick-and-place and bonding
Quality & Control
Quality levels and production yields are maintained through thorough control of all parameters across the technology lines.
- ✓Substrate cleaning: plasma cleaning before and after sputtering
- ✓Component cleaning: plasma cleaning before and after chip & wire operations
- ✓Nanometric accuracy for sputtered layers (1 in 5 test)
- ✓Micrometric accuracy for chip & wire (100% automatic inline dimensional test)
- ✓Electrical performance testing (100% inline for Tx/Rx and SIP)
- ✓Tape and Reel for all SIPs passing electrical tests
>100 GHz
Maximum supported frequency